Project Description

Digital Sensor-2-Cloud Campus Platform – Wireless, Fast, and Secure Cloud Integration at Just the Right Time

Objective

DTEC LOGO Digital Sensor-to-Cloud Campus Platform (DS2CCP) at Helmut Schmidt University

The increasing digitization and flexibility in Industry 4.0 and the Industrial Internet of Things (IIoT) require innovative wireless communication systems. Guaranteed compliance with deterministic latency, functional safety, and cybersecurity is critical for their practical industrial application.

The DS2CCP project develops comprehensive communication solutions that enable secure and robust wireless networking of sensors and actuators across all levels of the automation pyramid.

The Platform’s Three Technological Layers

  • 1. Shop-floor level: Robust, high-density sensor-actuator connectivity via the industry-standard IO-Link Wireless (IEC 61139-3).
  • 2. Edge & Backbone Layer: Transmission of time-sensitive data with guaranteed latencies over a 5G standalone network with integrated Time-Sensitive Networking (TSN).
  • 3. Cloud layer: Semantic interoperability, digital twin modeling, and data distribution using OPC UA Publish/Subscribe.

Real-World Laboratory & Demonstration Scenarios

The effectiveness of the developed solutions is demonstrated in real-world scenarios:

  • Electro-optical drone detection: Rapid tracking of small UAS in urban areas with image data transmission via 5G to the edge cloud.
  • Mobile Safety Control Units: Wireless emergency stop functions with seamless roaming between production cells.
  • Shape and Deformation Measurement: Wireless Finite Element Sensor Networks for Structural Health Monitoring.

For more information, visit the official DS2CCP project page at dtec.bw.

dtec.bw Funding Notice

HSU

Letzte Änderung: 28. August 2026